Infineon Technologies AG drew solid bids for its first euro debt in a year as it joined tech borrowers seeking to fund ambitious artificial intelligence projects.
Infineon Technologies AG drew solid bids for its first euro debt in a year as it joined tech borrowers seeking to fund ambitious artificial intelligence projects.
Infineon Technologies AG's 150 mm SiC wafer on display during the opening of the company's site of a new semiconductor complex in Kulim, Malaysia, on Thursday, Aug. 8, 2024. Infineon’s investments in Malaysia highlights the Southeast Asian nation’s potential to attract more tech investments at a time that major chip firms are seeking alternatives to China and Taiwan for manufacturing given increasing geopolitical uncertainties.
Telenet Group Holding NV has postponed plans to issue bonds and loans worth €1.95 billion ($2.3 billion) to refinance existing debt amid volatile markets and investor concern over its new corporate structure.
Telenet Group Holding NV has postponed plans to issue bonds and loans worth €1.95 billion ($2.3 billion) to refinance existing debt amid volatile markets and investor concern over its new corporate structure.
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